DAP Corporation engages in the provision of printed circuit boards (PCB) South Korea and internationally. The company offers HDI PCB structure and any layer, as well as 4D, 3D, D, C, and B type products. Its products are used in mobile phones, tablet PCs, wearables, and automobiles. The company also provides construction equipment, such as CNC/laser drill, router, oxide, lay-up, hot press, desmear, chemical and electrolytic plating, exposure, etching, AOI, photo solder resist, electroness nikel immersion gold, and organic solderability preservatives. The company was founded in 1987 and is headquartered in Anseong, South Korea.
Metrics to compare | 066900 | Sector Sector - Average of metrics from a broad group of related Technology sector companies | Relationship Relationship066900PeersSector | |
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P/E Ratio | −1.3x | 10.1x | 11.4x | |
PEG Ratio | 0.01 | 0.05 | 0.01 | |
Price/Book | 0.7x | 0.9x | 2.4x | |
Price / LTM Sales | 0.1x | 0.5x | 2.0x | |
Upside (Analyst Target) | - | 0.0% | 25.2% | |
Fair Value Upside | Unlock | 21.0% | 6.6% | Unlock |