🔥 Premium AI-powered Stock Picks from InvestingPro Now up to 50% OffCLAIM SALE

7 Indian startups approved for chip designing: Rajeev Chandrasekhar

Published 29-07-2023, 10:25 pm
© Reuters.  7 Indian startups approved for chip designing: Rajeev Chandrasekhar

Bengaluru, July 29 (IANS) The government aims to build a robust, globally competitive presence in the global semiconductor ecosystem in the next 10 years and so far, seven chip design startups have been approved for funding and assistance in developing their products, Minister of State for Electronics and IT, Rajeev Chandrasekhar, said on Saturday.In his address on the second day of 'Semicon India 2023', the minister said the future is bright for India in the global semiconductor ecosystem.

"So far, seven chip design startups have been approved for funding and assistance in developing their products. This initiative is steadily gaining confidence and support. It’s a relatively new opportunity for startups to delve into deep tech and semiconductor design," he said.

The government has launched a Digital India RISC-V programme (DIR-V) and a large number of startups and incubation centres built around academic institutions are focusing on the future of RISC-V and on the devices it operates on, Chandrasekhar said.

On the second day of the conference, the CDAC announced a partnership with Arm, the world’s leading semiconductor IP company, to empower semiconductor startups in the country through the "Arm Flexible Access for Startups" programme.

"Innovative silicon startups will drive the future of the semiconductor industry as they develop life-changing new technologies in areas from AI to autonomous vehicles and IoT," said Guru Ganesan, President, Arm India.

Two more startups/MSMEs involved in semiconductor design were announced as participants in the 'SemiconIndia futureDESIGN DLI’ scheme.

One of them is Aheesa Digital Innovations Pvt Ltd (Aheesa) located in Chennai, which focuses on telecom, networking and cyber security domains. The other startup is Bengaluru-based Calligo Technologies which serves global companies in HPC, Big Data and AI/ML segments.

The DLI scheme aims to offer financial incentives as well as design infrastructure support across various stages of development and deployment of semiconductor designs for Integrated Circuits (ICs), Chipsets, System on Chips (SoCs), Systems & IP Cores and semiconductor linked design(s) over a period of five years.

A key collaboration was also initiated through a MoU between the Centre for Nano Science and Engineering (CeNSE) at the Indian Institute of Science (IISc), Bengaluru, and Lam Research India.

--IANS

na/vd

Latest comments

Risk Disclosure: Trading in financial instruments and/or cryptocurrencies involves high risks including the risk of losing some, or all, of your investment amount, and may not be suitable for all investors. Prices of cryptocurrencies are extremely volatile and may be affected by external factors such as financial, regulatory or political events. Trading on margin increases the financial risks.
Before deciding to trade in financial instrument or cryptocurrencies you should be fully informed of the risks and costs associated with trading the financial markets, carefully consider your investment objectives, level of experience, and risk appetite, and seek professional advice where needed.
Fusion Media would like to remind you that the data contained in this website is not necessarily real-time nor accurate. The data and prices on the website are not necessarily provided by any market or exchange, but may be provided by market makers, and so prices may not be accurate and may differ from the actual price at any given market, meaning prices are indicative and not appropriate for trading purposes. Fusion Media and any provider of the data contained in this website will not accept liability for any loss or damage as a result of your trading, or your reliance on the information contained within this website.
It is prohibited to use, store, reproduce, display, modify, transmit or distribute the data contained in this website without the explicit prior written permission of Fusion Media and/or the data provider. All intellectual property rights are reserved by the providers and/or the exchange providing the data contained in this website.
Fusion Media may be compensated by the advertisers that appear on the website, based on your interaction with the advertisements or advertisers.
© 2007-2024 - Fusion Media Limited. All Rights Reserved.